ATRON SP 400
ATRON SP 400
For spray-in-air cleaning processes

ATRON®SP 400 is a water-based cleaning agent specifically developed to remove baked-on fluxes from solder pallets and condensation traps. ATRON®SP 400 is specially developed for spray-in-air cleaning processes.

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  • Can easily be filtered and therefore provides 3 to 10 times longer bath life than traditional surfactant cleaners
  • Excellent compatibility with solder pallets and condensation traps
  • Excellent compatibility with machine parts (i.e. made of PVC)
  • Has no flashpoint and can be used without ex-proofed equipment
  • No building of organics in the rinsing section
  • Low odor
  • Very stable against foaming, even with high flux content
ATRON SP 200
ATRON SP 200
For ultrasonic or air assisted cleaning equipment

ATRON®SP 200 is an aqueous-alkaline surfactant cleaner, specifically developed to remove baked-on fluxes from solder pallets, solder frames and condensation traps. ATRON®SP 200 can also be used for the removal of unsoldered solder pastes from SMT stencils. The cleaner is suitable for ultrasonic, air assisted cleaning equipment or spray-in-air.

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  • Simple, easy-to-use handling
  • 3 to 10 times longer bath life than traditional surfactant cleaners. The reduced number of bath changes results in a lower volume of used cleaner, which has to be disposed
  • Excellent compatibility with aluminum and epoxy surfaces
  • The use of de-foamer is not required
  • No build-up of organics in the rinsing section
  • ATRON®SP 200 is also suitable for the cleaning of conveyor fingers or the manual removal of extremely baked-on flux residues in solder ovens and similar applications
ATRON SP 300
ATRON SP 300
For spray-under-immersion or air assisted cleaning, also for cyclones

ATRON®SP 300 is an aqueous-alkaline cleaner, specifically designed to remove baked-on flux residues from cyclones, condensation traps, solder pallets and solder frames. ATRON®SP 300 can be used in single batch cleaning systems with air assisted cleaning and a unit for external cleaning of containers and tubing.

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  • Extremely long bath life ensures reduced cleaning agent costs
  • Excellent cleaning performance with all types of flux and solder paste residues
  • Solid content-free formula, therefore no water rinsing or active drying required
  • Also suitable for spray-in-air-equipment
  • Extremely low VOC reduces emission values
  • Low odor
  • Exceptional material compatibility
VIGON RC 303
VIGON RC 303
Reflow oven cleaner

VIGON®RC 303 is a reflow oven cleaner, specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensed fluxes and emissions from assemblies. The medium does not contain any ingredients which could leave residues on the oven surfaces. This avoids harmful condensation on the assembly surfaces after restarts.

As the successor to VIGON®RC 101, VIGON®RC 303 delivers an improved cleaning performance with the same high level of operator safety.

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  • Improved cleaning performance
  • Mild formulation, high operator safety
  • No flash point
  • Environmentally friendly
  • No special labeling is required
  • Little odor
  • Excellent material compatibility with aluminum and epoxy surfaces
VIGON RC 101
VIGON RC 101
For reflow ovens and wave solder systems, water-based

Based on the MPC®Technology, VIGON®RC 101 was specifically developed to remove all types of baked-on flux residues from reflow and wave solder equipment. It reliably removes re-condensated fluxes and emissions from assemblies.

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  • Has no flash point and therefore can be applied directly onto cold or warm surfaces (30 - 40 °C / 86 - 104 °F)
  • The medium does not contain any ingredients, which could leave residues on the oven surfaces. This avoids harmful condensations on the assembly surfaces after restarts
  • Due to the short soaking time, a quick and efficient cleaning process can be achieved and long machine downtimes can be avoided
ZESTRON HC
ZESTRON HC
Aerosol, adhesive removal from dispensing needles and tools

ZESTRON®HC is a modified alcohol-based cleaning agent designed to remove SMT adhesives from tools such as dispensing nozzles.  

ZESTRON®HC can also be used for the removal of solder particles and dust from pick & place nozzles. It is supplied in an aerosol can for easy manual application.

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  • Reliably removes SMT adhesives from dispensing nozzles and tools
  • Dries fast and residue-free
  • Does not contain any halogenated compounds
  • The removable dispenser also allows easy cleaning of dispensing nozzles
  • Also applicable for the removal of solder particles and dust from pick & place nozzles
ZESTRON ES 200
ZESTRON ES 200
Strong adhesive remover for ultrasonic applications

ZESTRON®ES 200 is a modified alcohol cleaning agent designed to remove epoxies (SMT adhesives and conductive adhesives) from tools (particularly dispensing needles) and electronic manufacturing substrates in ultrasonic cleaning equipment.

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  • ZESTRON®ES 200 has a high bath loading capability and therefore a long bath life as well as low maintenance costs
  • Specifically formulated to remove even persistent adhesive residues
  • Due to its high flash point, ZESTRON®ES 200 can be used in ultrasonic baths at a temperature between 20 - 60ºC / 68 - 140ºF
  • To ensure a short drying time, rinsing with ZESTRON®HC or water is recommended

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